Technical Support
Technical Capabilities
Industry-leading core technologies for your testing needs
ATC Automatic Temperature Control
Chamberless design, no LN2 needed, direct conduction heating and cooling — faster and safer
ISTC Independent Site Temperature Control
Independent temperature control per site, precision ±0.5°C, maximizing throughput
HPTC High Precision Temperature Control
Temperature precision ±0.5°C@23.5~90°C, ±1°C@90~125°C
High Voltage Testing
N2 Purge design, supporting stable 10KV+ high voltage testing
Modular Design
Optional Tube/Bowl Feeder/T&R and other input/output configurations
OCR/Visual Inspection
Top and bottom side recognition, contact visual inspection
Downloads
For product datasheets and technical documents, please contact our sales team
Contact Sales TeamFrequently Asked Questions
Supports QFP/LQFP/PLCC/SOP/TSOP/BGA/QFN/uBGA/PGA/FBGA/LGA/CSP and more, with sizes from 2x2mm to 50x50mm.
ATC (Automatic Temperature Control) uses direct conduction for heating and cooling without LN2, with shorter settling time (<10 min vs 30+ min), higher temperature accuracy (±1°C vs ±2-3°C), simpler installation, and safer operation.
Yes. We have a dedicated MEMS support team that can tailor test solutions to your needs, including chamber design, fixture design, and test flow optimization.
We have service locations or agents in Taiwan, China (Wuxi/Shenzhen/Beijing/Shanghai), Korea, Singapore, Malaysia, Philippines, and Thailand, providing rapid local service support.
Depending on the model and level of customization, typical lead time is approximately 3-6 months. Please contact our sales team for specific delivery schedules.
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